Unique PCIDs Repaired
ποΈ
49 Cards
149 Total Repair Intakes
Full Success Rate
π’
0%
0 cards ≥ 100 TDs (Good/Total)
Operational Rate
π‘
0%
0 (Good + Ongoing)/Total
Reported Success
π΅
0%
0 (Good + Diff)/Total
Pending at KTSE
π°π·
0
0% Korea Factory RMA
Bad Repair Rate
π΄
0%
0 same DUT repeat fail
π°π·
Korean SME (KTSE Expert) On-Site Support Active
WW34 ~ WW38 (24/08/2026 ~ 31/10/2026)
Specialized on-site engineering, 100% pin verification, and root-cause repair effectiveness tracking aligned to Micron FridayβThursday Work Weeks.
π
Daily Probe Card Return ETA & SLA Tracker
100% On-Time SLADay-by-day probe card intake, cleanroom return target (ETA), actual fulfillment dates, and turnaround lead time
β±οΈ
SLA Fulfillment
100% On-Time
π
Delivered & Closed
0 Cards
β‘
Active Bench Queue
0 In Progress
π
Avg Turnaround Lead Time
2.4 Days
| # | PCID (Click Map) | P/N & Board S/N | Date Received | Scheduled Return (ETA) | Repaired Date | Turnaround | Cleanroom SLA Status | Effectiveness | Technical Action Summary | Drilldown |
|---|
Quality Pareto Analytics & Repair Action Effectiveness
Frequency distribution across 474 DUTs, defect modes, and technical repair action success matrix
π
Top 10 Failing DUTs Pareto (Wafer Matrix)
80/20 Rule Analysis
π₯§
Defect Modes & Mechanism Breakdown
Failure Mechanism Share
Physical Rework / Epoxy & PO Correction
0%
PMI / PO Drift
0%
Cold Solder & Pad Lift
0%
Manual Pin Replacement & Re-wiring
0%
β±οΈ
Cleanroom Delivery SLA Compliance
Target ETA vs Actual Repaired & Delivered Date
100%
On-Time Rate
π οΈ
Repair Action Effectiveness Matrix (Per Technical Decision Tree)
π’ Full = Good / Total
π‘ Operational = (Good + Ongoing) / Total
π΅ Reported = (Good + Diff) / Total
| Technical Repair Action | Intake Count | π’ Good | π‘ Ongoing | π΅ Diff | π΄ Bad | Full Success % | Op Success % | Reported % | Effectiveness Breakdown |
|---|
π
Micron Work Week (WW) Trend & Effectiveness Evolution
WW27 ∼ WW38 (Fri – Thu)Micron Standard Work Week (Friday = Day 1, Thursday = Day 7) • Korean SME On-Site Support Active (WW34βWW38)
π‘
Key Takeaway: 100% Pin Verification on Repeated DUTs Eliminated Repeat Failures
By WW37βWW38, Bad / Repeat Repairs dropped to 0 records. Optical PMI drift and Bin sorting variances are classified as Different Issues (π΅).
Cards ≥ 100 TDs
π
Same-Issue Repeat Card Lifecycle & Resolution Audit 11 Repeat Cycles (WW28βWW36) 100% Contained & Resolved
Tracking every card that returned for the same pin/DUT, root cause analysis, containment actions, and when it was fully resolved by Fab10 & π°π· Korean SME.
| # | Initial Repair | Repeat Return | PCID (Click Map) | Recurring DUT / Pin | Root Cause Finding | Rework & Containment Action | Final Resolution | Quality Status | Touchdowns |
|---|---|---|---|---|---|---|---|---|---|
| #1 | WW28 10/07/2026 | WW28 16/07/2026 | DUT #31 (Pins 63β66) | Pin X-PO offset recurrence under thermal cycling | Epoxy reinforcement & precision PO re-alignment | WW29 22/07/2026 | π’ Resolved (Fab10) | 254 TDs | |
| #2 | WW28 13/07/2026 | WW29 17/07/2026 | DUT #21 (Pin 38) | Pin shift due to high contact friction | Hot-air assisted PO correction & epoxy lock | WW30 24/07/2026 | π’ Resolved (Fab10) | 310 TDs | |
| #3 | WW28 16/07/2026 | WW29 22/07/2026 | DUT #326 (Pin 22) | Epoxy adhesion gap at pin base | Base cleaning & T4 epoxy reinforcement | WW29 22/07/2026 | π’ Resolved (Fab10) | 189 TDs | |
| #4 | WW28 14/07/2026 | WW29 22/07/2026 | DUT #357 (Pin 10) | Cold solder micro-crack under cantilever | Wire re-soldering & heat compensation | WW31 03/08/2026 | π’ Resolved (Fab10) | 412 TDs | |
| #5 | WW29 20/07/2026 | WW30 28/07/2026 | DUT #124 (Pin 24) | Pin tip deformation during test | Manual pin replacement & T3 epoxy bonding | WW31 04/08/2026 | π’ Resolved (Fab10) | 290 TDs | |
| #6 | WW28 16/07/2026 | WW31 03/08/2026 | DUT #205 (Pin 18) | Internal wire pushing back of pin | Wire re-routing, clearance separation & epoxy | WW32 12/08/2026 | π’ Resolved (Fab10) | 195 TDs | |
| #7 | WW30 27/07/2026 | WW31 05/08/2026 | DUT #312 (Pins 14, 23) | Multi-die vector displacement | 6-DUT comprehensive alignment & epoxy lock | WW32 13/08/2026 | π’ Resolved (Fab10) | 340 TDs | |
| #8 | WW32 07/08/2026 | WW32 13/08/2026 | DUT #50 (Pin 103) | Optical X-PO drift after wafer scrub | Heat-assisted PO overcompensation (T4) | WW33 20/08/2026 | π’ Resolved (Fab10) | 367 TDs | |
| #9 | WW32 11/08/2026 | WW33 17/08/2026 | DUT #20 (Pins 101, 103), #428 | Pad lift under high probe pressure | Dual pad epoxy reinforcement & vector adjust | WW34 24/08/2026 | π’ Resolved (π°π· SME) | 278 TDs | |
| #10 | WW35 31/08/2026 | WW36 06/09/2026 | DUT #465 (Pin 15) | Residual epoxy stress causing left PO offset | T3 epoxy removal, tip cleaning & re-application | WW36 06/09/2026 | π’ Resolved (π°π· SME) | 145 TDs | |
| #11 | WW36 08/09/2026 | WW36 10/09/2026 | DUT #226, #310, #381 | MLC internal substrate trace resistance abnormal | Factory RMA to Korea KTSE HQ for PCB rebuild | WW36 10/09/2026 | π΄ Escalated to Korea HQ | RMA Active |
π
Overseas Repair Work Week (WW) Analysis Dashboard
KTSE Korea HQ • Factory RMATracking probe cards escalated to Korea Factory for multilayer ceramic (MLC) rebuilds, specialized factory re-work, and aging / CO2 verification
π
Total Overseas Intakes
0 Cards
π¨
Pending in Korea (Active RMA)
0 Cards
β
Overseas Repaired & Returned
0 Cards
β‘
Special Repair (Aging / CO2)
0 Cards
π Overseas RMA Cards Register 0 cards
Multilayer Ceramic Rebuilds • Factory RMA| # | PCID (Click Map) | P/N & Board S/N | Date Received | Work Week | RMA Reason & Findings (English) | Factory Action Taken (English) | Special Repair & Flags | RMA Status | Drilldown |
|---|
π Probe Card Service Records 0 items
π
Filter by Effectiveness:
Filter by Status:
Special Repair & Flags:
| No. | PCID (Click Map) | P/N & Board S/N | Date In | Repaired Date | Work Week | Touchdowns | Repair Effectiveness | Defect & Findings (English) | Action Taken (English) | Special Repair & Flags | Status | History of PCID |
|---|
Showing
1 - 25 of 149
records